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Factors affecting training effectiveness. A study of semiconductor wafer fabrication industry in Malaysia


Lin, Abdullah and Sharif, Mohmad Yazam (2008) Factors affecting training effectiveness. A study of semiconductor wafer fabrication industry in Malaysia. In: 4th National Human Resource Management Conference 2008, 17-19 August 2008 , Tiara Beach Resort, Port Dickson. (Unpublished)

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Abstract

Human Resource Development is one of the key issues for Malaysian companies since the introduction of Human Resource Development Fund (HRDF). This is the fact that rapid changes in the organizations need to develop a more focused and coherent approach to develop and manage people (Kirkpatrick 1979; Senge, 1990). The senior management must consider the important of providing training to the people by understanding and believing that training is one of the important factors in organizational effectiveness. For technological based industry such as in wafer fabrication, the technical training for technical staff is very crucial. Hence, the HR manager must really outline the required training programs focus to the outcomes as well as measuring the effectiveness of the training. Factors that contribute to the training effectiveness must be put into serious consideration so that the amount invested into training is benefited. As such, the objectives of this paper are to review previous literatures and reveal the factors that affect the training effectiveness and outcomes. The scope of this research covers the Semiconductor Wafer Fabrication Companies in Malaysia.

Item Type: Conference or Workshop Item (Paper)
Additional Information: Jointly organized by the Malaysian Institute of Human Resource Management, Universiti Utara Malaysia and the Negeri Sembilan State Government.
Subjects: H Social Sciences > HD Industries. Land use. Labor > HD28 Management. Industrial Management
Divisions: School of Economics, Finance & Banking
Depositing User: Mrs. Norazmilah Yaakub
Date Deposited: 23 Mar 2011 08:47
Last Modified: 15 Dec 2016 07:17
URI: http://repo.uum.edu.my/id/eprint/2663

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